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| NEC's 4 PIN SOP, 1.1 pF LOW OUTPUT CAPACITANCE 1-ch OPTICAL COUPLED MOSFET FEATURES * LOW C X R: C X R = 11 pF * * LOW OUTPUT CAPACITANCE: COUT = 1.1 pF TYP * 1 CHANNEL TYPE: (1a output) * DESIGNED FOR AC/DC SWITCHING LINE CHANGER * SMALL AND THIN PACKAGE: 4 pin SOP, Height = 2.1 mm * HIGH ISOLATION VOLTAGE: BV = 1500 Vr.m.s. * LOW OFFSET VOLTAGE * AVAILABLE ON TAPE AND REEL: PS7200R-1A-E3, E4, F3, F4 PS7200R-1A DESCRIPTION NEC's PS7200R-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side (input side) and MOS FETs on the output side. It is suitable for high-frequency signal control, due to its low C x R, low output capacitance, and low off-state leakage current. APPLICATIONS * MEASUREMENT EQUIPMENT ELECTRICAL CHARACTERISTICS (TA = 25 C) PART NUMBER SYMBOLS PARAMETERS Forward Voltage, IF = 10 mA Reverse Current, VR = 5 V Off-State Leakage Current, VD = 40 V Output Capacitance, V = 0 V, f = 1 MHz LED On-state Current, IL = 120 mA On-State Resistance, IF = 10 mA, IL = 10 mA IF = 10 mA, IL = 120 mA, t 10 ms Turn-on Time, IF = 10 mA, VO = 5 V, RL = 500 , PW 10 ms Turn-off Time, IF = 10 mA, VO = 5 V, RL = 500 , PW 10 ms Isolation Resistance, VI-O = 1.0 kVDC Isolation Capacitance, V = 0 V, f = 1 MHz UNITS V A nA pF mA ms ms pF 10 9 PS7200R-1A MIN TYP 1.2 MAX 1.4 5.0 10 1.1 2.0 10 11 0.03 0.3 12.5 14 0.5 1.0 MOS Diode FET VF IR ILOFF COUT IFon RON1 RON2 tON tOFF RI-O CI-O Coupled 0.3 Notes: 1. Test Circuit for Switching Time: IF Pulse Input VL Input 50% 0 PS7200R-1A 4 3 Input Monitor Rin RL VO Monitor VO = 5 V Output 90% 10% ton toff 1 2 2. The turn-on time and turn-off time are specified as input-pulse width 10 ms. Be aware that when the device operates with an input-pulse width of under 10 ms, the turn-on time and turn-off time will increase. California Eastern Laboratories PS7200R-1A ABSOLUTE MAXIMUM RATINGS1 (TA = 25C) SYMBOLS Diode IF VR PD IFP MOS FET VL IL ILP PD Coupled BV PT TA TSTG PARAMETERS Forward Current (DC) Reverse Voltage Power Dissipation Peak Foward Current2 Break Down Voltage Continuous Load Current Pulse Load Current3 (AC/DC Connection) Power Dissipation Isolation Total Power Dissipation Operating Ambient Temp. Storage Temperature Voltage4 UNITS mA V mW A V mA mA mW Vr.m.s. mW C C RATINGS 50 5.0 50 1 40 120 240 200 1500 250 -40 to +85 -40 to +100 RECOMMENDED OPERATING CONDITIONS (TA = 25C) PART NUMBER SYMBOLS PARAMETERS IF LED Operating Current VF LED Off Voltage PS7200R-1A UNITS mA V MIN TYP MAX 2 10 20 0 0.5 TYPICAL PERFORMANCE CURVES (TA = 25uC) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE 100 Maximum Forward Current, IF (mA) 80 Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. PW = 100 s, Duty Cycle = 1 %. 3. PW = 100 ms, 1 shot. 4. AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output. 60 40 20 OUTLINE DIMENSIONS (Units in mm) TOP VIEW 0 -25 0 25 50 75 85 100 Ambient Temperature (TA uC) 4.00.5 4 3 MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE 150 1 2 Maximum Load Current, IL (mA) 100 7.00.3 4.4 2.05 -0.05 0.4 -0.05 0.25 M +0.10 +0.08 +0.10 0.15 -0.05 50 +0.08 0.5 -0.05 0.50.3 2.54 0 -25 0 25 50 75 85 100 1. 2. 3. 4. LED Anode LED Cathode MOSFET MOSFET Ambient Temperature (TA uC) R P 0 S 2 7 1A TYPICAL PERFORMANCE CURVES (TA = 25uC) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE 1.6 California Eastern Laboratories OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 5.0 Output Capacitance, COUT (pF) f = 1 MHz 4.0 Forward Voltage, VF (V) 1.4 IF = 50 mA 1.2 30 mA 20 mA 10 mA 5 mA 1.0 1 mA 3.0 2.0 1.0 0.8 -25 0 25 50 75 100 0 0 10 20 30 40 50 60 Ambient Temperature (TA uC) Applied Voltage, VD (V) OFF-STATE LEAKAGE CURRENT vs. AMBIENT TEMPERATURE 10-7 LOAD CURRENT vs. LOAD VOLTAGE IF = 10 mA 200 Off-state Leakage Current, ILoff (A) VD = 40 V 10-8 Load Current, IL (mA) 10-9 100 10-10 -2.0 -1.0 0 1.0 2.0 10 -11 -100 10-12 10 -13 -200 0 20 40 60 80 100 Ambient Temperature,TA (uC) Load Voltage, VL (V) NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE ON-STATE RESISTANCE DISTRIBUTION 60 n = 50 pcs IF = 10 mA IL = 10 mA Normalized On-state Resistance, Ron 3.0 Normalized to 1.0 at TA = 25uC, IF = 10 mA IL = 10 mA 2.5 50 1.5 Number (pcs) 2.0 40 30 1.0 20 0.5 10 0.0 -25 0 0 25 50 75 100 9.2 9.4 9.6 9.8 10.0 Ambient Temperature,TA (uC) On-state Resistance, Ron () PS7200R-1A TYPICAL PERFORMANCE CURVES (TA = 25uC) TURN-ON TIME vs. FORWARD CURRENT 0.10 VO = 5 V RL = 500 TURN-OFF TIME vs. FORWARD CURRENT 2.0 VO = 5 V, RL = 500 1.6 Turn-on Time ton (mS) 0.08 0.06 Turn-off Time toff (mS) 30 1.2 0.04 0.8 0.02 0.4 0 0 5 10 15 20 25 0 5 10 15 20 25 30 Forward Current IF (mA) Forward Current IF (mA) TURN-ON TIME vs. FORWARD CURRENT 60 n = 50 pcs IF = 10 mA VO = 5 V RL = 500 TURN-ON TIME vs. FORWARD CURRENT 60 n = 50 pcs IF = 10 mA VO = 5 V, RL = 500 50 50 Number (pcs) 30 Number (pcs) 40 40 30 20 20 10 10 0 0.01 0.02 0.03 0.04 0.05 0 0.06 0.06 0.06 0.08 0.08 Turn-on Time ton (ms) Turn-off Time toff (ms) NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE 3.0 NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE 3.0 Normalized to 1.0 at TA = 25uC, IF = 10 mA VO = 5 V RL = 500 Normalized Turn-on Time, ton Normalized Turn-off Time, toff 2.5 Normalized to 1.0 at TA = 25uC, IF = 10 mA VO = 5 V RL = 500 2.5 2.0 2.0 1.5 1.5 1.0 1.0 0.5 0.5 0.0 -25 0 25 50 75 100 0.0 -25 0 25 50 75 100 Ambient Temperature,TA (uC) Ambient Temperature,TA (uC) PS7200R-1A TAPING SPECIFICATIONS (Units in mm) Tape Outline and Dimensions 2.0 0.05 1.75 0.1 4.0 0.1 o1.5 -0 +0.1 2.9 MAX 5.5 0.5 7.4 0.1 12.0 0.2 2.40.1 1.55 0.1 4.6 0.1 8.0 0.1 0.3 Tape Direction PS7200R-1A-E3 PS7200R-1A-E4 Reel Outline and Dimensions 2.0 2.00.5 o13.00.5 15 15 o21.00.8 13.00.5 o180 o60 13.01.0 Packing: 900 pcs/reel PS7200R-1A TAPING SPECIFICATIONS (Units in mm) Tape Outline and Dimensions 2.0 0.1 1.75 0.1 4.0 0.1 1.55 0.1 2.4 0.1 5.5 0.1 7.4 0.1 12.0 0.2 0.3 1.55 0.1 4.6 0.1 8.0 0.1 Tape Direction PS7200R-1A-F3 PS7200R-1A-F4 Reel Outline and Dimensions 1.5 12 0 21.0 0.8 1.5 0.5 60 6.0 1 330 2.0 0.5 13.00.5 805.0 12.4 -0.0 +2.0 PS7200R-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering * Peak reflow temperature * Time of temperature higher than 210 C * Number of reflows * Flux 235 C or below (package surface temperature) 30 seconds or less Two Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T (uC) (heating) to 10 s 235 uC (peak temperature) 210 uC to 30 s 100 to 160 uC 60 to 120 s (preheating) Time (s) (2) Dip soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260 C or below (molten solder temperature) 10 seconds or less 100C or below (package surface temperature) One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 11/11/2002 A Business Partner of NEC Compound Semiconductor Devices, Ltd. |
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